Sub Modeling
FEAP uses the unique sub-modeling approach as a tool to improve
the accuracy of results in a desired area. Using theresults of the first
FEAP analysis, a finer mesh is automatically created within the chosen
area which is used for further analysis. This approach saves
considerable time and computational effort in comparison to
analyzing a detailed mesh of the entire structure.
Solid Model of the End Pin |
As an extension to this analysis, a
detailed finite element model of the end
pins and solder joints of the end pins
and solder joints of the component is
generated using solid elements. Detailed
stresses are obtained in the leads, which
are used to predict the fatigue life of the
component.
POST ANALYSIS FEATURES
- Temperature distribution over entire PCB
- Case and junction temperature plots, including component
histories
- Automatic calculation of convective film coefficients from 3D fluid
flow results
- Automated mesh refinement around components of interest
using proprietary sub-modeling approach for greater accuracy
- Detailed solid models of end pins (surface mounted and
through-hole) with solder for accurate stress predictions
- Fatigue life estimation for mounted components
- Prediction of component reliabilities
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