NISA/FEAP
FEAP is the largest and most sophisticated finite element program for the stress,
random vibration, fatigue life, 3D convective fluid flow and thermal analysis of
printed circuit boards (PCBs) and electronic systems. FEAP totally integrates the
NISA II/DISPLAY III/IV family of programs to simultaneously perform any or all of
these analyses for any PCB configuration. This task is made easy by the fully
automated mesh generation and the pre- and post-processing capabilities that are
part of the program. Furthermore, a unique feature of FEAP allows the study of
forced cooling effects on PCBs and inside multiple board electronic systems
through a complete 3D convective fluid flow analysis.
FEAP is a program for performing a complete and detailed structural,
fatigue, thermal and fluid flow analysis on Printed Circuit Boards
(PCBs) and the mounted components including
- Steady state heat transfer
- Transient heat transfer
- 3D Fluid flow, Forced or
- Free convection
- Random vibration
- Frequency response
- Transient dynamics (shock
testing)
- Fatigue life computation
SALIENT FEATURES
- Extremely user friendly graphics pre-processor
- Fully automated finite element mesh generator
- Built-in interfaces to P-CAD, MENTOR GRAPHICS, PCBENGINEER,
etc.
- Large user-expandable built-in library of commercially used
component types
- Complete Integration
with NISA family of
programs
- Convenient FORM
based inputs, efficient
file management and
task control through
an interactive shell
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NISA/FEAP