Miscelleneous Features
The NISA analysis modules can be used to perform analysis of
electronic components and systems which are not directly supported
by FEAP. The general purpose pre- and post-processor DISPLAY III/IV
(of the NISA family of programs) can be used to model such
problems. Customized devices such as different configurations of
heat sinks, multi chip modules, and new ICs can be handled in this
manner. FEAP can be used as a starting point in many such detailed
analyses
THE PROBLEM
- Analysis of a finned heat sink with power transistors in an enclosure
- Forced cooling by a fan
ANALYSIS HIGHLIGHTS
Temperature Contours in the Heat Sink
- 3D mesh of brick elements generated
using DISPLAY III/IV
- Conjugate fluid-heat transfer analysis
using NISA-3D-FLUID
Conduction, Convection & Radiation
- Temperature contours in the heat sink
and surrounding fluid
- Velocity vectors in the fluid
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