Heat Transfer & Thermal Stress Analysis
Isothermal Contours in the PCB
Most problems in the electronics industry today are a result of the
heat generated by components mounted on a PCB. Using NISA/
HEAT, FEAP can analyze PCBs mounted with heat generating components and predict the
temperature profiles on the board
and components. Following a heat
transfer analysis, FEAP can
automatically perform a thermal
stress analysis of the system. FEAP
can then apply sub-modeling
techniques to refine the mesh
around specified components for
more detailed results.
MODELING CAPABILITIES:
- Multilayered PCB with components
- Specified temperatures at PCB edges
- Heat generation by the components
- Mounting of components on thermal pads
- Point heat sources
ANALYSIS HIGHLIGHTS
- Steady State and Transient conduction heat transfer through PCB
and components
- Convection and Radiation heat transfer from the PCB &
component surfaces
- Temperature distribution over the PCB and components
- Junction and case temperatures for all components
- Thermal stresses and warping in the PCB
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| Deformations Due to the Thermal Load |
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