Fatigue Analysis of End Pins
Fatigue Log Life Contours
Fatigue failure of component leads due to high thermal and dynamic
cyclic loads is a common cause for the failure of PCBs. Based on
dynamic and thermal stress analysis, FEAP can predict the fatigue life
of component end pins and solder joints. Once thermal stress and
dynamic analyses have been performed on the PCB, FEAP generates
solid models of the end pins in critically stressed areas. Stress analysis
of these models gives detailed and accurate stress distribution in the
end pins and solder joints. This stress distribution is further used to
perform a fatigue analysis of end pins using NISA-ENDURE. Several
pin-joint configurations are available in the FEAP library (e.g., pokethrough,
surface mounted J) along with several material types for
the joints.
MODELING CAPABILITIES
- Refined meshes around critical
components
- Solid models of end pins and solder
joints
- Several pin-joint configurations
- Material library for pins and solder
ANALYSIS HIGHLIGHTS
- Detailed stress distributions around critical components
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