COMPONENT LIBRARY IN FEAP

FEAP has an extensive built-in library of components which are commonly used in the electronic industry. Dual inline packages (DIPs), Flatpacks, Hybrid Packages, Pin arrays, Resistors, Capacitors, Leadless Chip Carriers, BGA etc., are present in the database. Geometric details, material properties and heat generation of these components are available in the FEAP database. These values can be changed with ease by the user. Several common configurations for each component type are predefined. The basic defaults contained in the FEAP database can be expanded to sixteen different configurations for each IC type. In addition, the user has the flexibility to define special configurations under each category of ICs. This provides great versatility to the FEAP preprocessor, which can access a database tailored to the needs of the user.