3D Fluid Analysis
Pressure Distribution in the Fluid
FEAP is integrated with NISA/3D-FLUID to simulate heat dissipation
due to forced convection. Forced cooling using a fan or a blower is
commonly used in electronic assemblies to maintain temperatures
below critical levels. The efficiency of
forced convection in dissipating heat
depends on the initial temperature,
velocity, type of fluid used as well as
component location with respect to each
other and to the source of the cooling fluid.
FEAP creates a finite element model of the PCB, components and
fluid channel. A complete 3D fluid flow analysis is performed. The
predictions of this analysis give the engineer a powerful tool to
improve the design of cooling techniques in electronic assemblies.
Modeling Capabilities:
- PCB with components & surrounding fluid
- Inlet and outlet fluid velocities and temperature boundary
conditions
ANALYSIS HIGHLIGHTS
- Conduction, Convection, and Radiation heat transfer
- Conjugate fluid-heat transfer
- Temperature distribution in the fluid, on the PCB and components
- Convective heat transfer coefficient calculation
- Velocity vectors in the fluid
- Pressure distribution in the fluid
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