SimFIRST'07
An Event on Simulation Based Product Development using eta/VPG, eta/DYNAFORM & LSTC’s LS-DYNA
Come and see how...
FORD, General Motors, CHRYSLER, TOYOTA, HYUNDAI, NISSAN, SUZUKI, US Steel, BaoSteel, PoaSteel, ALCOA, POSCO, Kapco, National Auto Rad (NARMCO), Canadian Eng., Russel, Electromac, Woodbine, Walker Tool and Die, Vollrath Company LLC, QMC Die Technology, Fleetwood Metal Industries, Fab-All Manufacturing, Veltri Metal Products, General Tool & Die, Wolverine Tool and Die, Experi-Metal Inc., Cameron Tool, Diescan, D.R. Tool and Design, Ascent Tool, Paulstra CRC, and other’s
...have benefited from eta/ VPG, eta/DYNAFORM & LS-DYNA
About SimFIRST’07
Date & Venue
Agenda for the Event
Product Overview
Profile of Speakers
Register Now
About SimFIRST’07
Are you a researcher or engineer involved in Computer Aided Engineering analysis like:
- Automotive crash testing
- Drop testing
- Automotive fatigue analysis
- Sheet metal forming
- Any other type of Non-linear Analysis
Then SimFIRST is for you!
At SimFIRST’07 you will:
- Learn first hand how FORTUNE 500 companies across the world are using eta/DYNAFORM, eta/VPG & LS-DYNA to solve many real-life non-linear problems
- Meet experts in Sheet Metal Forming and Crash Testing
- Network with fellow engineers from the same domain
- Get updated on the latest techniques in Metal Forming and Crash Testing
Come over. It will be time well spent.
Date & Venue
| Date |
Location |
Venue |
Address |
| 3rd Dec’ 07 |
Bangalore |
The Chancery Pavilion |
Residency Road,
Bangalore-560025 |
| 4th Dec’ 07 |
Chennai |
The Radisson |
No 531, GST Hotel
opp to Officers Training Academy,
St Thomas Mount,
Chennai-600016 |
| 6th Dec’ 07 |
Pune |
The Le Meridian |
Raja Bhadur Mill Road
Pune GPO
Pune-411001
|
| 7th Dec’ 07 |
Delhi |
Uppals Orchid |
National Highway No:8
Near IGR Airport
Mahipalpur,
New Delhi-110037 |
Agenda for the Event
| 9.00AM – 9.30AM |
Registration |
| 9.30AM – 10.00AM |
Welcome Address |
| 10.00AM – 10.45AM |
Introduction to VPG |
| 10.45AM – 11.00AM |
Tea |
| 11.00AM – 11.30AM |
VPG Part II |
| 11.30AM – 1.00PM |
Introduction to DYNAFORM |
| 1.00PM – 2.00PM |
Lunch |
| 2.00PM – 2.30PM |
Introduction to LS DYNA |
| 2.30 Onwards |
Question & Answers |
Product Overview
eta/DYNAFORM™: drastically reduces the risk and costs associated with the die design and development cycle by predicting formability problems before tooling takes place. Flawed or marginal die designs that would cost innumerable hours of labor, press time and material to repair and correct are evaluated on the computer at a fraction of the cost. By determining splitting, wrinkling, thinning, and springback effects that would occur during the stamping process before tooling is cut, timing concerns are eliminated while customer confidence and design confidence improve. DYNAFORM is a proven, cost-effective way to improve and insure your bottom-line. Integrated into DYNAFORM is the analysis engine, LS-DYNA, which is capable of implicit and explicit solutions for complete and accurate forming analysis.
eta/VPG™: is revolutionary, integrated at an earlier stage of the design process, eta/VPG reduces time, reduces costs and improves quality. VPG provides an efficient and comprehensive environment for development of finite element models. In addition, VPG delivers a unique set of tools which allow engineers to create and visualize advanced simulations for vehicle crashworthiness and dynamic durability. VPG includes a Pre-Post, Structure, Safety, Drop Test & Blast Module. VPG utilizes the LS-DYNA solver for accurate implicit and explicit analysis.
LS-DYNA™: is one of the world’s leading general purpose transient dynamic finite element program capable of simulating complex real world problems, which are generally highly non-linear. Complex physical behavior of 2D and 3D structures like nonlinear dynamics, thermal, failure, contact, quasi-static, Fluid-Structure-Interaction (FSI), multi-physics coupling, Eulerian, & Arbitrary-Lagrangian-Eulerian (ALE), etc can easily be simulated using LS-DYNA.
LS-DYNA's most widely used application areas are crashworthiness analysis, sheet metal forming analysis, drop tests, underwater shock, explosions, high-velocity impacts, explosive forming, process engineering, accident reconstruction, vehicle dynamics, disc brake analysis & nuclear safety. Apart from traditional engineering materials LS-DYNA can be used to study the behavior of materials like composites, ceramics, concrete & wood.
Profile of Speakers
Tim Palmer
Mr. Tim Palmer started his career at General Motors Corporation, in the Corvette Development Group, after receiving a Bachelor of Science in Mechanical Engineering from Michigan Technological University.
Mr. Palmer joined Engineering Technology Associates, Inc. in 1986 and has previously held the position of Chief Engineer, prior to his current assignment as Director of VPG Business Development. While also working in testing and design, his career focus has been working directly with analysis methods, and applications to vehicle system analysis.
Mr. Palmer has authored or co-authored numerous technical papers on the subject of Virtual Proving Ground simulations, and holds a U.S. Patent for the technology behind these simulations.
In 2003 Mr. Palmer was awarded the SAE Henry Ford II Award for Excellence in Automotive Engineering, in recognition for his work in automotive simulation.
C. C. Chen
Mr. C. C. Chen has more than 10 years of experience in CAD/CAM/CAE in sheet metal stamping industry. He has worked in National Steel Corporation , Ford and DCX. At ETA he is the Business Director and handles technical support, sales and marketing of Dynaform and VPG in South East Asia, as well as other Asia Pacific countries.
Register Now
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