PCB Housing Cooling Analysis
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Convective boundary conditions on the housing |
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Temperature distribution and resistor |
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Temperature distribution in the housing in the PCB |
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Objective:
Overheating of electronic components in an enclosed geometry is an important study in today’s age of miniaturization. A manufacturer needed to determine the amount of thermal power dissipation into the resistor (in Yellow in FE Model), in order to maintain the IC (in Green) temperature of 85°C, at different atmospheric temperatures.
Methodology:
Passive electronic components were modeled with beam, shell and solid elements. The heat transfer coefficient was calculated analytically for different ambient temperatures. Combined conduction and convection heat transfer modes are considered. Steady state heat transfer analysis was carried out for the heat dissipation into the resistor so as to maintain the IC at 85°C. The heat flux to be transmitted to the resistor at an ambient temperature of 25°C was found, so as to maintain the temperature of the IC at 85°C.
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Case Studies